It has excellent adhesion, water resistance, abrasion resistance, corrosion resistance and insulation

It has excellent adhesion, water resistance, abrasion resistance, corrosion resistance and insulation

Accelerant for curing epoxy and polyurethane systems without discoloration.

Fast reaction speed, strong heat and corrosion resistance, widely used in various anti-corrosion, construction, water conservancy projects; Adhesives, coatings and other aspects

Fast reaction speed, strong heat and corrosion resistance, widely used in various anti-corrosion, construction, water conservancy projects; Adhesives, coatings and other aspects

With four functional groups, high crosslinking density and aromatic ring density can be formed during curing, especially in high temperature resistance and humidity resistance.

Medium molecular weight epoxy dispersion, good flexibility, adhesion and corrosion resistance, can be coated thickly.

Liquid epoxy, 100% solid, ZERO VOC, good flexibility, adhesion and corrosion resistance, can be thick-coated.

Liquid epoxy dispersion, good flexibility, adhesion and corrosion resistance, quick drying

Liquid epoxy dispersion, good flexibility, adhesion and corrosion resistance

Strong heat and corrosion resistance, good strength and toughness. At room temperature without any diluent, add a large amount of packing. Add 2%-10%DMP-30 for better effect.

Strong heat and corrosion resistance, good strength and toughness. It can also be used for resin curing agent compounding.

Fast reaction speed, strong heat and corrosion resistance, widely used in various anti-corrosion, construction, water conservancy projects; Adhesives, coatings and other aspects

Fast reaction speed, strong heat and corrosion resistance, widely used in various anti-corrosion, construction, water conservancy projects; Adhesives, coatings and other aspects

Fast reaction speed, strong heat and corrosion resistance, widely used in various anti-corrosion, construction, water conservancy projects; Adhesives, coatings and other aspects

Epoxy curing agent and accelerator

Phenolic amine T-31D curing agent

[Description]

T-31D product belongs to phenolic modified fatty amine curing agent, with fast reaction speed, strong heat resistance and corrosion resistance.

Technical indicators

Appearance: Light yellow liquid

Viscosity 800-2000 CPS

Active hydrogen equivalent: 70

Amine value: 450-500

【 Application 】 Fast response speed, strong heat and corrosion resistance, widely used in various anti-corrosion, construction, and water conservancy projects; In terms of adhesives, anchoring adhesives, and other coatings.

[Packaging and Storage]

Packaging in polypropylene drums or coated iron drums, 25kg or 200kg.

Sealed packaging from the date of production, stored at room temperature for 24 months, away from high temperature and high humidity areas

Low viscosity, no solvent. Excellent curing speed and film properties, and excellent adhesion to concrete, primers and intermediate coats. Floor paint and self leveling areas.

Low viscosity, no solvent. Excellent curing speed and film properties, and excellent adhesion to concrete, primers and intermediate coats. Floor paint and self leveling areas.

Reduce the viscosity of epoxy curing system, improve the impact and shear strength.

Accelerator for curing epoxy and polyurethane systems. Low temperature curing at -5℃.

Accelerant for curing epoxy and polyurethane systems without discoloration.

Accelerator for curing epoxy and polyurethane systems.

Accelerator for curing epoxy and polyurethane systems.

• 2. Application areas

   

  • Epoxy resin curing acceleration:
    • In epoxy resin systems, DMP-30 is widely used as a curing accelerator. It can significantly speed up the reaction between epoxy resins and various curing agents such as acid anhydrides, dicyandiamide, and phenolic resins. For example, in the production of epoxy coatings, adhesives, and casting resins, adding an appropriate amount of DMP-30 can reduce the curing time and lower the curing temperature, which is beneficial for improving production efficiency and reducing energy consumption.
    • In the case of epoxy-acid anhydride curing systems, DMP-30 can catalyze the reaction between the epoxy groups of the epoxy resin and the carboxyl groups of the acid anhydride, promoting the formation of a cross-linked network structure.
  • Composite materials:
    • When preparing epoxy-based composite materials (such as glass fiber-reinforced composites, carbon fiber-reinforced composites), DMP-30 can be used to adjust the curing process. It helps to ensure that the epoxy resin matrix cures uniformly and quickly around the reinforcing fibers, enhancing the mechanical properties of the composite materials, such as strength and toughness.
  • Electrical insulation materials:
    • In the production of electrical insulation products like electrical insulators, transformer insulation components, and electrical encapsulants made of epoxy resin, DMP-30 plays an important role in accelerating the curing process. This ensures that the final products have good electrical insulation properties and mechanical stability.
  • Adhesive applications:
    • Epoxy adhesives are widely used in various industries for bonding different materials. DMP-30 can be added to epoxy adhesive formulations to make the adhesive cure faster, which is useful in applications where quick bonding is required, such as in the automotive and aerospace industries for bonding metal parts, composites, and other components.
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ZH2003D is a cashew phenol modified phenalkamine epoxy curing agent. It features low viscosity and solvent-free properties, along with excellent chemical resistance. It also exhibits good adhesion on damp concrete surfaces and is insensitive to moisture. Additionally, it boasts superior adhesion and anti-corrosion performance.

ZH2950 is an accelerator specifically designed for amine-based epoxy curing agents. In solvent-free epoxy coating systems, its accelerating effect is equivalent to that of products such as K54 (DMP-30). When used alone as a curing agent for 128 epoxy resin, it can achieve surface drying in 2.5 hours and complete curing in 24 hours at 5°C. When used as an accelerator in solvent-based epoxy coatings, its pot life is approximately twice that of K54. Its accelerating effect is even more significant when applied in polyurethane systems. It is miscible with water.